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Brand Name : Bicheng Technologies Limited
Model Number : BIC-182-V9.9
Certification : UL
Place of Origin : China
MOQ : 1
Price : USD 9.99-99.99
Payment Terms : T/T, Paypal
Supply Ability : 45000 pieces per month
Delivery Time : 10 working days
Packaging Details : Vacuum
Glass Epoxy : RF-10
Final height of PCB : 1.6mm ± 10%
Final foil external : 1 oz
Surface Finish : Immersion gold (23.3% ) 0.05µm over 3µm nickel
Solder Mask Color : Green
Colour of Component Legend : White
Number of Layers : 2
Test : 100% Electrical Test prior shipment
60mil RF-10 High Frequency PCB Double Sided Taconic Microwave PCB Low Loss High DK RF PCBs
(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)
General Description
This type of low loss high DK PCB is built on 60mil RF-10 substrate.It is a double layer build-up with large area of immersion gold and partial green solder mask. Finished copper 1oz are on both sides. The boards are fabricated per IPC 6012 Class 2 using supplied Gerber data. Every 25 boards are packed for shipment.
PCB Specifications
| PCB SIZE | 90 x 100mm=1up | 
| BOARD TYPE | Double sided PCB | 
| Number of Layers | 2 layers | 
| Surface Mount Components | YES | 
| Through Hole Components | NO | 
| LAYER STACKUP | copper ------- 17um(0.5 oz)+plate TOP layer | 
| RF-10 1.524mm | |
| copper ------- 17um(0.5 oz) + plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 4 mil / 4 mil | 
| Minimum / Maximum Holes: | 0.3 mm / 4.0 mm | 
| Number of Different Holes: | 5 | 
| Number of Drill Holes: | 211 | 
| Number of Milled Slots: | 5 | 
| Number of Internal Cutouts: | 3 | 
| Impedance Control: | no | 
| Number of Gold finger: | 0 | 
| BOARD MATERIAL | |
| Glass Epoxy: | RF-10 1.524mm | 
| Final foil external: | 1.0 oz | 
| Final foil internal: | N/A | 
| Final height of PCB: | 1.6 mm ±0.16 | 
| PLATING AND COATING | |
| Surface Finish | Immersion Gold, 89% | 
| Solder Mask Apply To: | Top layer | 
| Solder Mask Color: | Green | 
| Solder Mask Type: | LPI | 
| CONTOUR/CUTTING | Routing | 
| MARKING | |
| Side of Component Legend | N/A | 
| Colour of Component Legend | N/A | 
| Manufacturer Name or Logo: | N/A | 
| VIA | Plated through hole(PTH), minimum size 0.3mm. | 
| FLAMIBILITY RATING | 94V-0 | 
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" | 
| Board plating: | 0.0029" | 
| Drill tolerance: | 0.002" | 
| TEST | 100% Electrical Test prior shipment | 
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc | 
| SERVICE AREA | Worldwide, Globally. | 

Typical Applications
1.Aircraft Collision Avoidance Systems
2.GPS Antennas
3.Microstrip Patch Antennas
4.Passive Components (filters, couplers, power dividers)
5.Satellite Components
Why choose us?
1.ISO9001, ISO14001, IATF16949, ISO13485, UL Certified;
2.More than 18+ years’ high frequency PCB experience;
3.Small quantity order is available, no MOQ required;
4.We’re a Team of passion, discipline, responsibility and honesty;
5.Delivery on time: >98%, Customer complaint rate: <1%
6.16000㎡ workshop, 30000㎡ output a month and 8000 types of PCB's a month;
7.Powerful PCB capabilities support your research and development, sales and marketing;
8.IPC Class 2 / IPC Class 3
Typical Value of RF-10
| Property | Test Method | Unit | Value | Unit | Value | 
| Dk @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 10.2 ± 0.3 | 10.2 ± 0.3 | ||
| Df @ 10 GHz | IPC-650 2.5.5.5.1 Mod. | 0.0025 | 0.0025 | ||
| TcK† (-55 to 150 °C) | IPC-650 2.5.5.6 | ppm/°C | -370 | ppm/°C | -370 | 
| Moisture Absorption | IPC-650 2.6.2.1 | % | 0.08 | % | 0.08 | 
| Peel Strength (1 oz. RT copper) | IPC-650 2.4.8 (solder) | lbs/in | 10 | N/mm | 1.7 | 
| Volume Resistivity | IPC-650 2.5.17.1 | Mohm/cm | 6.0 x 107 | Mohm/cm | 6.0 x 107 | 
| Surface Resistivity | IPC-650 2.5.17.1 | Mohm | 1.0 x 108 | Mohm | 1.0 x 108 | 
| Flexural Strength (MD) | IPC - 650 - 2.4.4 | psi | 14,000 | N/mm2 | 96.53 | 
| Flexural Strength (CD) | IPC - 650 - 2.4.4 | psi | 10,000 | N/mm2 | 68.95 | 
| Tensile Strength (MD) | IPC - 650 - 2.4.19 | psi | 8,900 | N/mm2 | 62.57 | 
| Tensile Strength (CD) | IPC - 650 - 2.4.19 | psi | 5,300 | N/mm2 | 37.26 | 
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (25 mil-MD) | -0.0032 | % (25 mil-CD) | -0.0239 | 
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (25 mil-MD) | -0.0215 | % (25 mil-CD) | -0.0529 | 
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (25 mil-MD) | -0.0301 | % (25 mil-CD) | -0.0653 | 
| Dimensional Stability | IPC-650 2.4.39 (After Etch) | % (60 mil-MD) | -0.0027 | % (60 mil-CD) | -0.0142 | 
| Dimensional Stability | IPC-650 2.4.39 (After Bake) | % (60 mil-MD) | -0.1500 | % (60 mil-CD) | -0.0326 | 
| Dimensional Stability | IPC-650 2.4.39 (After Stress) | % (60 mil-MD) | -0.0167 | % (60 mil-CD) | -0.0377 | 
| Density (Specific Gravity) | IPC-650-2.3.5 | g/cm3 | 2.77 | g/cm3 | 2.77 | 
| Specific Heat | IPC-650-2.4.50 | J/g°C | 0.9 | J/g°C | 0.9 | 
| Thermal Conductivity (Unclad) | IPC-650-2.4.50 | W/M*K | 0.85 | W/M*K | 0.85 | 
| CTE (X -Y axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 16-20 | ppm/°C | 16-20 | 
| CTE (Z axis) (50 to 150 °C) | IPC-650 2.4.41 | ppm/°C | 25 | ppm/°C | 25 | 
| Flammability Rating | Internal | V-0 | V-0 | 

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